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PDF HMC572 Data sheet ( Hoja de datos )
| Número de pieza | HMC572 | |
| Descripción | GaAs MMIC I/Q DOWNCONVERTER | |
| Fabricantes | Hittite Microwave | |
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v02.0809
HMC572
GaAs MMIC I/Q DOWNCONVERTER
24 - 28 GHz
Typical Applications
The HMC572 is ideal for:
• Point-to-Point and Point-to-Multi-Point Radio
3 • Military Radar, EW & ELINT
• Satellite Communications
Features
Conversion Gain: 8 dB
Image Rejection: 20 dB
2 LO to RF Isolation: 40 dB
Noise Figure: 3.5 dB
Input IP3: +5 dBm
Die Size: 2.33 x 2.37 x 0.10 mm
3 - 146
Functional Diagram
General Description
The HMC572 is a compact GaAs MMIC I/Q
downconverter chip which provides a small signal
conversion gain of 8 dB with a noise figure of 3.5 dB
and 20 dB of image rejection across the frequency
band. The device utilizes an LNA followed by an image
reject mixer which is driven by an active x2 multiplier.
The image reject mixer eliminates the need for a filter
following the LNA, and removes thermal noise at the
image frequency. I and Q mixer outputs are provided
and an external 90° hybrid is needed to select the
required sideband. All data shown below is taken
with the chip mounted in a 50 Ohm test fixture and
includes the effects of 1 mil diameter x 20 mil length
bond wires on each port. This product is a much
smaller alternative to hybrid style image reject mixer
downconverter assemblies.
Electrical Specifications, TA = +25° C, IF = 100 MHz, LO = +4 dBm, Vdd = 3.5 Vdc*
Parameter
Frequency Range, RF
Frequency Range, LO
Frequency Range, IF
Conversion Gain (As IRM)
Noise Figure
Image Rejection
1 dB Compression (Input)
2 LO to RF Isolation
2 LO to IF Isolation
IP3 (Input)
Amplitude Balance
Phase Balance
Total Supply Current
*Data taken as IRM with external IF 90° hybrid
Min.
7
17
-7
40
28
+5
Typ.
24.5 - 26.5
9 - 15.5
DC - 3.5
9
3.5
20
-5
43
32
+7
0.3
5
125
Max.
165
Min. Typ. Max.
24 - 28
9 - 15.5
DC - 3.5
79
3.5
17 23
-8 -6
38 45
27 30
+3 +5
0.7
7
125 165
Units
GHz
GHz
GHz
dB
dB
dB
dBm
dB
dB
dBm
dB
Deg
mA
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
1 page  
Outline Drawing
3
v02.0809
HMC572
GaAs MMIC I/Q DOWNCONVERTER
24 - 28 GHz
Die Packaging Information [1]
Standard
Alternate
GP-1 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS 0.004”
3. BOND PAD METALIZATION: GOLD
4. BACKSIDE METALIZATION: GOLD
5. BACKSIDE METAL IS GROUND
6. OVERALL DIE SIZE ±0.002
3 - 150
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet HMC572.PDF ] | |
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