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PDF FDMC610P Data sheet ( Hoja de datos )

Número de pieza FDMC610P
Descripción MOSFET ( Transistor )
Fabricantes Fairchild Semiconductor 
Logotipo Fairchild Semiconductor Logotipo



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No Preview Available ! FDMC610P Hoja de datos, Descripción, Manual

FDMC610P
P-Channel PowerTrench® MOSFET
-12 V, -80 A, 3.9 mΩ
Features
„ Max rDS(on) = 3.9 mΩ at VGS = -4.5 V, ID = -22 A
„ Max rDS(on) = 6.4 mΩ at VGS = -2.5 V, ID = -16 A
„ State-of-the-art switching performance
„ Lower output capacitance, gate resistance, and gate charge
boost efficiency
„ Shielded gate technology reduces switch node ringing and
increases immunity to EMI and cross conduction
„ RoHS Compliant
November 2013
General Description
This P-Channel MOSFET has been designed specifically to
improve the overall efficiency and to minimize switch node
ringing of DC/DC converters using either synchronous or
conventional switching PWM controllers. It has been optimized
for low gate charge, low rDS(on), fast switching speed and body
diode reverse recovery performance.
Applications
„ High side switching for high end computing
„ High power density DC-DC synchronous buck converter
Pin 1
D
D
D
D
S
S
D
D
G
S
S
S
Pin 1
S
G
D
D
Top Bottom
Power 33
MOSFET Maximum Ratings TA = 25 °C unless otherwise noted
Symbol
VDS
VGS
ID
PD
TJ, TSTG
Parameter
Drain to Source Voltage
Gate to Source Voltage
Drain Current - Continuous
- Continuous
TC = 25 °C
- Pulsed
Power Dissipation
TC = 25 °C
Power Dissipation
TA = 25 °C
Operating and Storage Junction Temperature Range
Thermal Characteristics
RθJC
RθJA
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
Package Marking and Ordering Information
TC = 25 °C
TA = 25 °C
(Note 1a)
(Note 1a)
(Note 1a)
Ratings
-12
±8
-80
-22
-200
48
2.4
-55 to +150
2.6
53
Units
V
V
A
W
°C
°C/W
Device Marking
23AB
Device
FDMC610P
Package
Power 33
Reel Size
13 ’’
Tape Width
12 mm
Quantity
3000 units
©2013 Fairchild Semiconductor Corporation
FDMC610P Rev.C
1
www.fairchildsemi.com

1 page




FDMC610P pdf
Typical Characteristics TJ = 25 °C unless otherwise noted
2
1 DUTY CYCLE-DESCENDING ORDER
0.1
0.01
D = 0.5
0.2
0.1
0.05
0.02
0.01
0.001
SINGLE PULSE
0.0001
10-4
10-3
10-2
10-1
1
10
t, RECTANGULAR PULSE DURATION (sec)
PDM
t1
t2
NOTES:
ZθJA(t) = r(t) x RθJA
RθJA = 125 °C/W
Peak TJ = PDM x ZθJA(t) + TA
Duty Cycle, D = t1 / t2
100 1000
Figure 12. Junction-to-Ambient Transient Thermal Response Curve
©2013 Fairchild Semiconductor Corporation
FDMC610P Rev.C
5
www.fairchildsemi.com

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