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PDF BALF-CC25-02D3 Data sheet ( Hoja de datos )
| Número de pieza | BALF-CC25-02D3 | |
| Descripción | conjugate match to CC2541 transformer balun | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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BALF-CC25-02D3
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EXPSV
50 ohm, conjugate match to CC2541
transformer balun
Datasheet − production data
Description
STMicroelectronics BAL-CC25-02D3 is an ultra
miniature balun which integrates a matching
network in a monolithic glass substrate. This has
been customized for the CC2541 RF
transceivers.
It’s a design using STMicroelectronics IPD
(integrated passive device) technology on non-
conductive glass substrate to optimize RF
performance.
Figure 1. Pin configuration (top view)
Features
• 2.45 GHz balun with integrated matching
network
• Matching optimized for following CC2541
• Low insertion loss
• Low amplitude imbalance
• Low phase imbalance
• Coated Flip-Chip on glass
• Small footprint: < 0.88 mm²
Benefits
• Very low profile
• High RF performance
• PCB space saving versus discrete solution
• BOM count reduction
• Efficient manufacturability
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Figure 2. Application schematic (top view)
November 2015
This is information on a product in full production.
DocID028619 Rev 1
1/11
www.st.com
11
1 page  
BALF-CC25-02D3
2 Package information
Package information
• Epoxy meets UL94, V0
• Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
2.1
Flip-Chip package information
Figure 9. Flip-Chip package outline
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Table 3. Flip-Chip package mechanical data
Parameter
Description
Min.
Typ.
A Bump height + substrate thickness
0.570 0.630
A1 Bump height
A2 Substrate thickness
0.155
0.205
0.400
b Bump diameter
0.215 0.255
D Y dimension of the die
0.890 0.940
D1 Y pitch
E X dimension of the die
0.890
0.500
0.940
E1 X pitch
0.500
SE 0.250
fD
Distance from bump to edge of die on Y
axis
0.220
fE
Distance from bump to edge of die on X
axis
0.220
ccc
$ 0.025
Max.
0.690
0.255
0.295
0.990
0.990
0.05
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
DocID028619 Rev 1
5/11
5 Page 
BALF-CC25-02D3
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2015 STMicroelectronics – All rights reserved
DocID028619 Rev 1
11/11
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet BALF-CC25-02D3.PDF ] | |
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