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S-25A040A fiches techniques PDF

Seiko - SPI SERIAL E2PROM

Numéro de référence S-25A040A
Description SPI SERIAL E2PROM
Fabricant Seiko 
Logo Seiko 





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S-25A040A fiche technique
S-25A010A/020A/040A
www.sii-ic.com
© SII Semiconductor Corporation, 2008-2014
FOR AUTOMOTIVE 125°C OPERATION
SPI SERIAL E2PROM
Rev.5.2_01
This IC is a SPI serial E2PROM which operates under the high temperature, at high speed, with the wide range operation for
automotive components. This IC has the capacity of 1 K-bit, 2 K-bit, 4 K-bit and the organization of 128 words × 8-bit, 256
words × 8-bit, 512 words × 8-bit. Page write and Sequential read are available.
Caution Before using the product in automobile control unit or medical equipment, contact to SII Semiconductor
Corporation is indispensable.
Features
Packages
Operating voltage range
Read:
2.5 V to 5.5 V
Write:
2.5 V to 5.5 V
Operation frequency:
Write time:
SPI mode (0, 0) and (1, 1)
Page write:
Sequential read
Write protect:
Protect area:
6.5 MHz max.
4.0 ms max.
16 bytes / page
Software, Hardware
25%, 50%, 100%
Monitoring of a write memory state by the status register
Function to prevent malfunction by monitoring clock pulse
Write protect function during the low power supply voltage
CMOS schmitt input ( CS , SCK, SI, WP , HOLD )
Endurance*1:
106 cycle / word*2 (Ta = +25°C)
5 × 105 cycle / word*2 (Ta = +125°C)
Data retention:
100 years (Ta = +25°C)
50 years (Ta = +125°C)
Memory capacity
S-25A010A:
1 K-bit
S-25A020A:
2 K-bit
S-25A040A:
4 K-bit
Initial delivery state:
FFh, BP1 = 0, BP0 = 0
Burn-in specification:
Wafer level burn-in
Operation temperature range: Ta = 40°C to +125°C
Lead-free (Sn 100%), halogen-free*3
AEC-Q100 qualified*4
*1. Refer to "Endurance" for details.
*2. For each address (Word: 8-bit)
*3. Refer to "Product Name Structure" for details.
*4. Contact our sales office for details.
8-Pin SOP (JEDEC)
5
8
4
1
(5.0 × 6.0 × t1.75 mm)
8-Pin TSSOP
5
8
4
1
(3.0 × 6.4 × t1.1 mm)
TMSOP-8
5
8
4
1
(2.9 × 4.0 × t0.8 mm)
Remark Refer to "3. Product name list" in "Product Name Structure" for details of package and product.
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