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PDF EM68C16CWQE Data sheet ( Hoja de datos )
| Número de pieza | EM68C16CWQE | |
| Descripción | 64M x 16 bit DDRII Synchronous DRAM | |
| Fabricantes | Etron Technology | |
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EtronTech
EM68C16CWQE
64M x 16 bit DDRII Synchronous DRAM (SDRAM)
Advance (Rev. 1.6, May /2016)
Features
JEDEC Standard Compliant
JEDEC standard 1.8V I/O (SSTL_18-compatible)
Power supplies: VDD & VDDQ = +1.8V 0.1V
Operating temperature: TC = 0~85°C
Supports JEDEC clock jitter specification
Fully synchronous operation
Fast clock rate: 333/400/533 MHz
Differential Clock, CK & CK#
Bidirectional single/differential data strobe
- DQS & DQS#
8 internal banks for concurrent operation
4-bit prefetch architecture
Internal pipeline architecture
Precharge & active power down
Programmable Mode & Extended Mode registers
Posted CAS# additive latency (AL): 0, 1, 2, 3, 4, 5, 6
WRITE latency = READ latency - 1 tCK
Burst lengths: 4 or 8
Burst type: Sequential / Interleave
DLL enable/disable
Off-Chip Driver (OCD)
- Impedance Adjustment
- Adjustable data-output drive strength
On-die termination (ODT)
RoHS compliant
Auto Refresh and Self Refresh
8192 refresh cycles / 64ms
84-ball 8 x 12.5 x 1.2mm (max) FBGA package
- Pb and Halogen Free
Overview
The EM68C16C is a high-speed CMOS Double-
Data-Rate-Two (DDR2), synchronous dynamic random
- access memory (SDRAM) containing 1024 Mbits in a
16-bit wide data I/Os. It is internally configured as a 8-
bank DRAM, 8 banks x 8Mb addresses x 16 I/Os. The
device is designed to comply with DDR2 DRAM key
features such as posted CAS# with additive latency,
Write latency = Read latency -1, Off-Chip Driver (OCD)
impedance adjustment, and On Die Termination(ODT).
All of the control and address inputs are synchronized
with a pair of externally supplied differential clocks.
Inputs are latched at the cross point of differential clocks
(CK rising and CK# falling). All I/Os are synchronized
with a pair of bidirectional strobes (DQS and DQS#) in
a source synchronous fashion. The address bus is used
to convey row, column, and bank address information
in RAS #, CAS# multiplexing style. Accesses begin with
the registration of a Bank Activate command, and then
it is followed by a Read or Write command. Read and
write accesses to the DDR2 SDRAM are 4 or 8-bit burst
oriented; accesses start at a selected location and
continue for a programmed number of locations in a
programmed sequence. Operating the eight memory
banks in an interleaved fashion allows random access
operation to occur at a higher rate than is possible with
standard DRAMs. An auto precharge function may be
enabled to provide a self-timed row precharge that is
initiated at the end of the burst sequence. A sequential
and gapless data rate is possible depending on burst
length, CAS latency, and speed grade of the device.
Table 1. Ordering Information
Part Number
Clock Frequency Data Rate
EM68C16CWQE-18H
533MHz
1066Mbps/pin
EM68C16CWQE-25H
400MHz
800Mbps/pin
EM68C16CWQE-3H
333MHz
667Mbps/pin
WQ: indicates 8 x 12.5 x 1.2mm FBGA Package
E: indicates Generation Code
H: indicates Pb and Halogen Free
Power Supply
VDD 1.8V, VDDQ 1.8V
VDD 1.8V, VDDQ 1.8V
VDD 1.8V, VDDQ 1.8V
Package
FBGA
FBGA
FBGA
Etron Technology, Inc.
No. 6, Technology Rd. V, Hsinchu Science Park, Hsinchu, Taiwan 30078, R.O.C.
TEL: (886)-3-5782345 FAX: (886)-3-5778671
Etron Technology, Inc. reserves the right to change products or specification without notice.
1 page  
EtronTech
EM68C16CWQE
Ball Descriptions
Table 3. Ball Descriptions
Symbol Type
Description
CK, CK#
Input
Differential Clock: CK, CK# are driven by the system clock. All SDRAM input signals are
sampled on the crossing of positive edge of CK and negative edge of CK#. Output (Read)
data is referenced to the crossings of CK and CK# (both directions of crossing).
CKE
Input
Clock Enable: CKE activates (HIGH) and deactivates (LOW) the CK signal. If CKE goes
LOW synchronously with clock, the internal clock is suspended from the next clock cycle
and the state of output and burst address is frozen as long as the CKE remains LOW.
When all banks are in the idle state, deactivating the clock controls the entry to the Power
Down and Self Refresh modes.
BA0-BA2
Input Bank Address: BA0-BA2 define to which bank the BankActivate, Read, Write, or Bank
Precharge command is being applied.
A0-A12
Input Address Inputs: A0-A12 are sampled during the BankActivate command (row address A0-
A12) and Read/Write command (column address A0-A9 with A10 defining Auto Precharge).
CS# Input Chip Select: CS# enables (sampled LOW) and disables (sampled HIGH) the command
decoder. All commands are masked when CS# is sampled HIGH. CS# provides for external
bank selection on systems with multiple banks. It is considered part of the command code.
RAS#
Input
Row Address Strobe: The RAS# signal defines the operation commands in conjunction
with the CAS# and WE# signals and is latched at the crossing of positive edges of CK and
negative edge of CK#. When RAS# and CS# are asserted "LOW" and CAS# is asserted
"HIGH" either the BankActivate command or the Precharge command is selected by the
WE# signal. When the WE# is asserted "HIGH" the BankActivate command is selected and
the bank designated by BA is turned on to the active state. When the WE# is asserted
"LOW" the Precharge command is selected and the bank designated by BA is switched to
the idle state after the precharge operation.
CAS#
Input
Column Address Strobe: The CAS# signal defines the operation commands in
conjunction with the RAS# and WE# signals and is latched at the crossing of positive edges
of CK and negative edge of CK#. When RAS# is held "HIGH" and CS# is asserted "LOW"
the column access is started by asserting CAS# "LOW". Then, the Read or Write command
is selected by asserting WE# “HIGH" or “LOW".
WE#
Input
Write Enable: The WE# signal defines the operation commands in conjunction with the
RAS# and CAS# signals and is latched at the crossing of positive edges of CK and negative
edge of CK#. The WE# input is used to select the BankActivate or Precharge command
and Read or Write command.
LDQS,
LDQS#
UDQS
UDQS#
Input /
Output
Bidirectional Data Strobe: Specifies timing for Input and Output data. Read Data Strobe is
edge triggered. Write Data Strobe provides a setup and hold time for data and DQM. LDQS
is for DQ0~7, UDQS is for DQ8~15. The data strobes LDOS and UDQS may be used in
single ended mode or paired with LDQS# and UDQS# to provide differential pair signaling
to the system during both reads and writes.A control bit at EMR (1)[A10] enables or disables
all complementary data strobe signals.
LDM,
UDM
Input Data Input Mask: Input data is masked when DM is sampled HIGH during a write cycle.
LDM masks DQ0-DQ7, UDM masks DQ8-DQ15.
DQ0 - DQ15 Input / Data I/O: The Data bus input and output data are synchronized with positive and negative
Output edges of DQS/DQS#. The I/Os are byte-maskable during Writes.
ODT
Input
On Die Termination: ODT enables internal termination resistance. It is applied to each DQ,
LDQS/LDQS#, UDQS/UDQS#, LDM, and UDM signal. The ODT pin is ignored if the EMR
(1) is programmed to disable ODT.
VDD Supply Power Supply: +1.8V 0.1V
VSS Supply Ground
Rev. 1.6
5
May /2016
5 Page 
EtronTech
EM68C16CWQE
EMR(2)
The extended mode register (2) controls refresh related features. The default value of the extended mode register (2)
is not defined, therefore the extended mode register (2) must be written after power-up for proper operation. The
extended mode register(2) is written by asserting LOW on CS#, RAS#, CAS#, WE#, HIGH on BA1 and LOW on
BA0, while controlling the states of address pins A0 ~ A12. The DDR2 SDRAM should be in all bank precharge with
CKE already HIGH prior to writing into the extended mode register (2). The mode register set command cycle time
(tMRD) must be satisfied to complete the write operation to the extended mode register (2). Mode register contents
can be changed using the same command and clock cycle requirements during normal operation as long as all
banks are in the precharge state.
Table 7. Extended Mode Register EMR(2) Bitmap
BA2 BA1 BA0 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 Address Field
0*5 1
0
0*1
SRF
0*1
DCC
PASR*3
Extended Mode Register(2)
A7 High Temperature Self-Refresh Rate Enable
0 Disable
1 Enable *2
BA1 BA0 MRS mode
00
MR
0 1 EMR(1)
1 0 EMR(2)
1 1 EMR(3)
A3 DCC Enable *4
0 Disable
1 Enable
A2 A1 A0 Partial Array Self Refresh for 4 Banks
0 0 0 Full array
0 0 1 Half Array (BA[1:0]=00&01)
0 1 0 Quarter Array (BA[1:0]=00)
0 1 1 Not defined
1 0 0 3/4 array (BA[1:0]=01,10&11)
1 0 1 Half array (BA[1:0]=10&11)
1 1 0 Quarter array (BA[1:0]=11)
1 1 1 Not defined
NOTE 1: The rest bits in EMRS(2) are reserved for future use and all bits in EMRS(2) except A0-A2, A7, BA0 and BA1 must
be programmed to 0 when setting the extended mode register(2) during initialization.
NOTE 2: Due to the migration nature, user needs to ensure the DRAM part supports higher than 85°C Tcase temperature
self-refresh entry. If the high temperature self-refresh mode is supported then controller can set the EMRS2[A7] bit
to enable the self-refresh rate in case of higher than 85°C temperature self-refresh operation.
NOTE 3: If PASR (Partial Array Self Refresh) is enabled, data located in areas of the array beyond the specified location will
be lost if self refresh is entered. Data integrity will be maintained if tREF conditions are met and no Self Refresh
command is issued.
NOTE 4: DCC (Duty Cycle Corrector) implemented, user may be given the controllability of DCC thru EMR (2) [A3] bit.
NOTE 5: BA2 is reserved for future use and must be set to 0 when programming the MR.
Rev. 1.6
11
May /2016
11 Page | ||
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