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PDF EM68C08CWAE Data sheet ( Hoja de datos )
| Número de pieza | EM68C08CWAE | |
| Descripción | 128M x 8 bit DDRII Synchronous DRAM | |
| Fabricantes | Etron Technology | |
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EtronTech
EM68C08CWAE
128M x 8 bit DDRII Synchronous DRAM (SDRAM)
Advance (Rev. 1.3, Oct. /2015)
Features
• JEDEC Standard Compliant
• JEDEC standard 1.8V I/O (SSTL_18-compatible)
• Power supplies: VDD & VDDQ = +1.8V ± 0.1V
• Operating temperature: TC = 0~85 °C
• Supports JEDEC clock jitter specification
• Fully synchronous operation
• Fast clock rate: 333/400/533 MHz
• Differential Clock, CK & CK#
• Bidirectional single/differential data strobe
• 8 internal banks for concurrent operation
• 4-bit prefetch architecture
• Internal pipeline architecture
• Precharge & active power down
• Programmable Mode & Extended Mode registers
• Posted CAS# additive latency (AL): 0, 1, 2, 3, 4, 5
• WRITE latency = READ latency - 1 tCK
• Burst lengths: 4 or 8
• Burst type: Sequential / Interleave
• DLL enable/disable
• Off-Chip Driver (OCD)
- Impedance Adjustment
- Adjustable data-output drive strength
• On-die termination (ODT)
• RoHS compliant
• Auto Refresh and Self Refresh
• 8192 refresh cycles / 64ms
• 60-ball 8 x 10 x 1.2mm (max) FBGA package
- Pb and Halogen Free
Overview
The EM68C08C is a high-speed CMOS Double-
Data-Rate-Two (DDR2), synchronous dynamic random
- access memory (SDRAM) containing 1024 Mbits in
an 8-bit wide data I/Os. It is internally configured as an
8-bank DRAM, 8 banks x 16Mb addresses x 8 I/Os.
The device is designed to comply with DDR2 DRAM
key features such as posted CAS# with additive latency,
Write latency = Read latency -1, Off-Chip Driver (OCD)
impedance adjustment and On Die Termination(ODT).
All of the control and address inputs are synchronized
with a pair of externally supplied differential clocks.
Inputs are latched at the cross point of differential clocks
(CK rising and CK# falling). All I/Os are synchronized
with a pair of bidirectional strobes (DQS and DQS#) in
a source synchronous fashion. The address bus is used
to convey row, column, and bank address information
in RAS #, CAS# multiplexing style. Accesses begin
with the registration of a Bank Activate command, and
then it is followed by a Read or Write command. Read
and write accesses to the DDR2 SDRAM are 4 or 8-bit
burst oriented; accesses start at a selected location
and continue for a programmed number of locations in
a programmed sequence. Operating the eight memory
banks in an interleaved fashion allows random access
operation to occur at a higher rate than is possible with
standard DRAMs. An auto precharge function may be
enabled to provide a self-timed row precharge that is
initiated at the end of the burst sequence. A sequential
and gapless data rate is possible depending on burst
length, CAS latency, and speed grade of the device.
Table 1. Ordering Information
Part Number
Clock Frequency
EM68C08CWAE-18H
533MHz
EM68C08CWAE-25H
400MHz
EM68C08CWAE-3H
333MHz
WA: indicates 8 x 10 x 1.2mm FBGA package
E: indicates Generation Code
H: indicates Pb and Halogen Free
Data Rate
1066Mbps/pin
800Mbps/pin
667Mbps/pin
Power Supply
VDD 1.8V, VDDQ 1.8V
VDD 1.8V, VDDQ 1.8V
VDD 1.8V, VDDQ 1.8V
Package
FBGA
FBGA
FBGA
Etron Technology, Inc.
No. 6, Technology Rd. V, Hsinchu Science Park, Hsinchu, Taiwan 30078, R.O.C.
TEL: (886)-3-5782345 FAX: (886)-3-5778671
Etron Technology, Inc. reserves the right to change products or specification without notice.
1 page  
EtronTech
EM68C08CWAE
Ball Descriptions
Table 3. Ball Descriptions
Symbol
CK, CK#
CKE
BA0-BA2
A0-A13
Type
Input
Input
Input
Input
Description
Differential Clock: CK, CK# are driven by the system clock. All SDRAM input signals are
sampled on the crossing of positive edge of CK and negative edge of CK#. Output (Read)
data is referenced to the crossings of CK and CK# (both directions of crossing).
Clock Enable: CKE activates (HIGH) and deactivates (LOW) the CK signal. If CKE goes
LOW synchronously with clock, the internal clock is suspended from the next clock cycle
and the state of output and burst address is frozen as long as the CKE remains LOW.
When all banks are in the idle state, deactivating the clock controls the entry to the Power
Down and Self Refresh modes.
Bank Address: BA0-BA2 define to which bank the BankActivate, Read, Write, or
BankPrecharge command is being applied.
Address Inputs: A0-A13 are sampled during the BankActivate command (row address
A0-A13) and Read/Write command (column address A0-A9 with A10 defining Auto
Precharge). A13 Row Address use on x8 components only.
CS#
Input
Chip Select: CS# enables (sampled LOW) and disables (sampled HIGH) the command
decoder. All commands are masked when CS# is sampled HIGH. CS# provides for
external bank selection on systems with multiple banks. It is considered part of the
command code.
RAS#
CAS#
Input
Input
Row Address Strobe: The RAS# signal defines the operation commands in conjunction
with the CAS# and WE# signals and is latched at the crossing of positive edges of CK
and negative edge of CK#. When RAS# and CS# are asserted "LOW" and CAS# is
asserted "HIGH" either the BankActivate command or the Precharge command is
selected by the WE# signal. When the WE# is asserted "HIGH" the BankActivate
command is selected and the bank designated by BA is turned on to the active state.
When the WE# is asserted "LOW" the Precharge command is selected and the bank
designated by BA is switched to the idle state after the precharge operation.
Column Address Strobe: The CAS# signal defines the operation commands in
conjunction with the RAS# and WE# signals and is latched at the crossing of positive
edges of CK and negative edge of CK#. When RAS# is held "HIGH" and CS# is asserted
"LOW" the column access is started by asserting CAS# "LOW". Then, the Read or Write
command is selected by asserting WE# "HIGH" or "LOW".
WE#
Input
Write Enable: The WE# signal defines the operation commands in conjunction with the
RAS# and CAS# signals and is latched at the crossing of positive edges of CK and
negative edge of CK#. The WE# input is used to select the BankActivate or Precharge
command and Read or Write command.
DQS,
DQS#
RDQS
RDQS#
Input /
Output
Bidirectional Data Strobe: output with read data, input with write data. Edge aligned
with read data, centered with write data. For the RDQS option using DM pin can be
enabled via the EMR(1) to simplify read timing.The data strobes DQS and RDQS may be
used in single ended mode or paired with the optional complementary signals DQS# and
RDQS# to provide differential pair signaling to the system during both reads and writes.
An EMRS (1) control bit enables or disables the complementary data strobe signals.
DM
DQ0 – DQ7
ODT
Input Data Input Mask: Input data is masked when DM is sampled HIGH during a write cycle.
x8 device, the function of DM or RDQS/RQDS# is enabled by EMRS command.
Input / Data I/O: Bi-directional data bus.
Output
Input
On Die Termination: ODT enables internal termination resistance. It is applied to each
DQ, DQS/DQS#, RDQS/RDQS# and DM signal. The ODT pin is ignored if the EMR (1) is
programmed to disable ODT.
VDD Supply Power Supply: +1.8V ±0.1V
Rev. 1.3
5
Oct. /2015
5 Page 
EtronTech
EM68C08CWAE
Table 6-2. Extended Mode Register EMR (1) Bitmap
A11 A10
(RDQS Enable) (DQS# Enable)
RDQS
/DM
RDQS#
0(Disable)
0(Disable)
1(Enable)
1(Enable)
0(Enable)
1(Disable)
0(Enable)
1(Disable)
DM
DM
RDQS
RDQS
Hi-z
Hi-z
RDQS#
Hi-z
DQS
DQS
DQS
DQS
DQS
DQS#
DQS#
Hi-z
DQS#
Hi-z
EMR(2)
The extended mode register (2) controls refresh related features. The default value of the extended mode register
(2) is not defined, therefore the extended mode register (2) must be written after power-up for proper operation. The
extended mode register(2) is written by asserting LOW on CS#, RAS#, CAS#, WE#, HIGH on BA1 and LOW on
BA0, while controlling the states of address pins A0 ~ A13. The DDR2 SDRAM should be in all bank precharge with
CKE already HIGH prior to writing into the extended mode register (2). The mode register set command cycle time
(tMRD) must be satisfied to complete the write operation to the extended mode register (2). Mode register contents
can be changed using the same command and clock cycle requirements during normal operation as long as all
banks are in the precharge state.
Table 7. Extended Mode Register EMR (2) Bitmap
BA2 BA1 BA0 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 Address Field
0*1 1 0
0*1
SRF
0*1
DCC
PASR*3
Extended Mode Register(2)
A7 High Temperature Self-Refresh Rate Enable
0 Disable
1 Enable *2
BA1 BA0 MRS mode
00
MR
A3 DCC Enable (Optional) *4
0 Disable
0 1 EMR(1)
1 Enable
1 0 EMR(2)
1 1 EMR(3)
A2 A1 A0 Partial Array Self Refresh for 8 Banks (Optional)
0 0 0 Full array
0 0 1 Half Array (BA[2:0]=000,001,010&011)
0 1 0 Quarter Array (BA[2:0]= 000&001)
0 1 1 1/8 array (BA[2:0]=000)
1 0 0 3/4 array (BA[2:0]=010,011,100,101,110&111)
1 0 1 Half array (BA[2:0]= 100,101,110&111)
1 1 0 Quarter array (BA[2:0]= 110&111)
1 1 1 1/8 array (BA[2:0]=111)
NOTE 1: BA2 and A4-A6, A8-A13 is reserved for future use and must be set to 0 when programming the EMR(2).
NOTE 2: Due to the migration nature, user needs to ensure the DRAM part supports higher than 85°C Tcase temperature
self-refresh entry. If the high temperature self-refresh mode is supported then controller can set the EMRS2[A7] bit
to enable the self-refresh rate in case of higher than 85°C temperature self-refresh operation.
NOTE 3: If PASR (Partial Array Self Refresh) is enabled, data located in areas of the array beyond the specified location will
be lost if self refresh is entered. Data integrity will be maintained if tREF conditions are met and no Self Refresh
command is issued.
NOTE 4: DCC (Duty Cycle Corrector) implemented, user may be given the controllability of DCC thru EMR (2) [A3] bit.
Rev. 1.3
11
Oct. /2015
11 Page | ||
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| PDF Descargar | [ Datasheet EM68C08CWAE.PDF ] | |
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