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PDF EM63B165TS Data sheet ( Hoja de datos )

Número de pieza EM63B165TS
Descripción 32M x 16 bit Synchronous DRAM
Fabricantes Etron Technology 
Logotipo Etron Technology Logotipo



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EtronTech
EM63B165TS
32M x 16 bit Synchronous DRAM (SDRAM)
Advance (Rev. 2.0, Feb. /2016)
Features
Fast access time from clock: 4.5/5/5.4 ns
Fast clock rate: 200/166/143 MHz
Fully synchronous operation
Internal pipelined architecture
8M word x 16-bit x 4-bank
Programmable Mode registers
- CAS Latency: 2 or 3
- Burst Length: 1, 2, 4, 8, or full page
- Burst Type: Sequential or Interleaved
- Burst stop function
Auto Refresh and Self Refresh
8192 refresh cycles/64ms
CKE power down mode
Single +3.3V ±0.3V power supply
Operating Temperature: TA = 0~70°C
Interface: LVTTL
54-pin 400 mil plastic TSOP II package
- Pb free and Halogen free
Overview
The EM63B165 SDRAM is a high-speed CMOS
synchronous DRAM containing 512 Mbits. It is
internally configured as 4 Banks of 8M word x 16
DRAM with a synchronous interface (all signals
are registered on the positive edge of the clock
signal, CLK). Read and write accesses to the SDRAM
are burst oriented; accesses start at a selected
location and continue for a programmed number of
locations in a programmed sequence. Accesses
begin with the registration of a Bank Activate command
which is then followed by a Read or Write command.
The EM63B165 provides for programmable Read
or Write burst lengths of 1, 2, 4, 8, or full page, with
a burst termination option. An auto precharge function
may be enabled to provide a self-timed row precharge
that is initiated at the end of the burst sequence.
The refresh functions, either Auto or Self Refresh
are easy to use. By having a programmable mode
register, the system can choose the most suitable
modes to maximize its performance. These devices
are well suited for applications requiring high memory
bandwidth and particularly well suited to high
performance PC applications.
Table 1. Key Specifications
tCK3
tAC3
tRAS
tRC
EM63B165
Clock Cycle time(min.)
Access time from CLK (max.)
Row Active time(min.)
Row Cycle time(min.)
Table 2. Ordering Information
Part Number
Frequency
EM63B165TS-5SG
200MHz
EM63B165TS-6SG
166MHz
EM63B165TS-7SG
143MHz
TS: indicates TSOPII Package
S: indicates Stacked Dice
G: indicates Pb and Halogen Free
-5/6/7
5/6/7
4.5/5/5.4
40/42/42
55/60/63
ns
ns
ns
ns
Package
TSOP II
TSOP II
TSOP II
Etron Technology, Inc.
No. 6, Technology Rd. V, Hsinchu Science Park, Hsinchu, Taiwan 30078, R.O.C.
TEL: (886)-3-5782345 FAX: (886)-3-5778671
Etron Technology, Inc. reserves the right to change products or specification without notice.

1 page




EM63B165TS pdf
EtronTech
EM63B165TS
DQ0-DQ15
NC
VDDQ
VSSQ
VDD
VSS
Input /
Output
-
Suply
Supply
Supply
Supply
Data I/O: The DQ0-15 input and output data are synchronized with the positive
edges of CLK. The I/Os are maskabled during Reads and Writes.
No Connect: These pins should be left unconnected.
DQ Power: Provide isolated power to DQs for improved noise immunity. (+3.3V 0.3V)
DQ Ground: Provide isolated ground to DQs for improved noise immunity. (0 V)
Power Supply: +3.3V 0.3V
Ground
Rev. 2.0
5 Feb. /2016

5 Page





EM63B165TS arduino
EtronTech
EM63B165TS
CLK
COMMAND
T0 T1 T2 T3 T4 T5 T6 T7 T8
NOP
WRITE A READ B
NOP
NOP
NOP
NOP
NOP
NOP
CAS# Latency=2
tCK2, DQ
DIN A0
don’t care
DOUT B0 DOUT B1 DOUT B2 DOUT B3
CAS# Latency=3
tCK3, DQ
DIN A0
don’t care
don’t care
DOUT B0 DOUT B1 DOUT B2 DOUT B3
Input data must be removed from the DQ at
least one clock cycle before the Read data
appears on the outputs to avoid data contention
Figure 12. Write Interrupted by a Read (Burst Length = 4, CAS# Latency = 2, 3)
The BankPrecharge/PrechargeAll command that interrupts a write burst without the auto
precharge function should be issued m cycles after the clock edge in which the last data-in element is
registered, where m equals tWR/tCK rounded up to the next whole number. In addition, the DQM signals
must be used to mask input data, starting with the clock edge following the last data-in element and
ending with the clock edge on which the BankPrecharge/PrechargeAll command is entered (refer to the
following figure).
CLK
DQM
COMMAND
T0 T1 T2 T3 T4 T5 T6 T7
WRITE
NOP
NOP
Precharge
tRP
NOP
NOP
Activate
NOP
ADDRESS
DQ
Bank
Col n
DIN
n
tWR
DIN
N+1
Bank (s)
ROW
Don’t Care
Note: The DQMs can remain low in this example if the length of the write burst is 1 or 2.
Figure 13. Write to Precharge
7 Write and AutoPrecharge command
(RAS# = "H", CAS# = "L", WE# = "L", BAs = Bank, A10 = "H", A0-A9 = Column Address)
The Write and AutoPrecharge command performs the precharge operation automatically after the
write operation. Once this command is given, any subsequent command can not occur within a time
delay of {(burst length -1) + tWR + tRP(min.)}. At full-page burst, only the write operation is performed in
this command and the auto precharge function is ignored.
Rev. 2.0
11 Feb. /2016

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