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PDF NLU1GT04 Data sheet ( Hoja de datos )
| Número de pieza | NLU1GT04 | |
| Descripción | Single Inverter | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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NLU1GT04
Single Inverter, TTL Level
LSTTL−Compatible Inputs
The NLU1GT04 MiniGatet is an advanced CMOS high−speed
inverting buffer in ultra−small footprint.
The device input is compatible with TTL−type input thresholds and
the output has a full 5.0 V CMOS level output swing.
The NLU1GT04 input and output structures provide protection
when voltages up to 7 V are applied, regardless of the supply voltage.
Features
• High Speed: tPD = 3.8 ns (Typ) @ VCC = 5.0 V
• Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
• TTL−Compatible Input: VIL = 0.8 V; VIH = 2.0 V
• CMOS−Compatible Output:
VOH > 0.8 VCC; VOL < 0.1 VCC @ Load
• Power Down Protection Provided on inputs
• Balanced Propagation Delays
• Ultra−Small Packages
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
NC 1
6 VCC
IN A 2
5 NC
GND 3
4 OUT Y
Figure 1. Pinout (Top View)
IN A 1 OUT Y
Figure 2. Logic Symbol
www.onsemi.com
MARKING
DIAGRAMS
UDFN6
MU SUFFIX
M
CASE 517AA
1
UDFN6
MU SUFFIX
CASE 517AQ
PM
1
N or P = Device Marking
M = Date Code
PIN ASSIGNMENT
1 NC
2 IN A
3 GND
4 OUT Y
5 NC
6 VCC
FUNCTION TABLE
AY
LH
HL
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2016
June, 2016 − Rev. 3
1
Publication Order Number:
NLU1GT04/D
1 page  
NLU1GT04
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA
ISSUE D
D
PIN ONE
REFERENCE
2X
0.10 C
ÉÉÉÉ
TOP VIEW
2X
0.10 C
0.10 C
10X 0.08 C
SIDE VIEW
A
B
E
(A3)
A
A1
EDGE OF PACKAGE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
L1 AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
DETAIL A
PAD AS WELL AS THE TERMINALS.
Bottom View
MILLIMETERS
(Optional)
DIM MIN MAX
A 0.45 0.55
EXPOSED Cu
MOLD CMPD
A1 0.00 0.05
A3 0.127 REF
ÉÉÉÉÉÉ
A1 DETAIL B
b 0.15 0.25
D 1.20 BSC
A3 E 1.00 BSC
e 0.40 BSC
L 0.30 0.40
L1 0.00 0.15
L2 0.40 0.50
Side View
SEATING
PLANE
C
(Optional)
MOUNTING FOOTPRINT*
6X
0.42
6X
0.22
5X L
13
L2
6X b
0.10 C A B
0.05 C NOTE 3
6
4
e
BOTTOM VIEW
0.40
PITCH
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet NLU1GT04.PDF ] | |
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