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PDF BH67172NUX Data sheet ( Hoja de datos )
| Número de pieza | BH67172NUX | |
| Descripción | Three-Phase Full-Wave Fan Motor Driver | |
| Fabricantes | ROHM Semiconductor | |
| Logotipo |  |
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Datasheet
DC Brushless Fan Motor Drivers
Three-Phase Full-Wave
Fan Motor Driver
BH67172NUX
●General description
BH67172UX is a three-phase sensorless fan motor
driver used to cool off notebook PCs. It is controlled by a
variable speed provided through the PWM input signal.
Its feature is sensorless drive which doesn’t require a
hall device as a location detection sensor and motor
downsizing can be achieved by limiting the number of
external components as much as possible. Furthermore,
introducing a direct PWM soft switched driving
mechanism achieves silent operations and low
vibrations.
●Features
Speed controllable by PWM input signal
Sensorless drive
Soft switched drive Quick start
Power save function
Internal RNF resistance
Quick start function
●Application
Small fan motor notebook PCs etc.
●Package
VSON010X3030
W (Typ.) x D (Typ.) x H (Max.)
3.00mm x 3.00mm x 0.60mm
VSON010X3030
●Absolute maximum ratings
Parameter
Symbol
Limit
Supply voltage
Power dissipation
VCC
Pd
−0.3～6.5
464 *1
Operating temperature
Topr –25 to +95
Storage temperature
Output current
Tstg
Iomax
–55 to +125
700*2
FG signal output voltage
VFG
6.5
FG signal output current
IFG 6
Junction temperature
Tjmax
125
*1 Reduce by 4.64mW/°C over Ta=25°C. (On 74.2mm×74.2mm×1.6mm glass epoxy board)
*2 This value is not to exceed Pd.
Unit
V
mW
°C
°C
mA
V
mA
°C
●Recommended operating conditions
Parameter
Operating supply voltage range
Symbol
VCC
Limit
1.8 to 5.5
Unit
V
○Product structure：Silicon monolithic integrated circuit
.www.rohm.co
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
○This product is not designed protection against radioactive rays
1/16
TSZ02201-0H1H0B100300-1-2
31.JUL.2012 Rev.002
1 page  
BH67172NUX
●Typical performance curves(Reference data)
Datasheet
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.0
95°C
25°C
–25°C
0.1 0.2 0.3 0.4 0.5 0.6
Output sink current: Io[A]
Fig.7 Output voltage (Vcc=5V)
0.7
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.0
1.8V
5V
5.5V
0.1 0.2 0.3 0.4 0.5 0.6
Output sink current: Io[A]
Fig.8 Output voltage (Ta=25°C)
0.7
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
95°C
25°C
–25°C
12345
Output sink current: Ifg[mA]
Fig.9 FG low voltage (Vcc=5V)
6
0.8
0.7
0.6
0.5
0.4
5.5V
0.3
5V
0.2 1.8V
0.1
0.0
0
12345
Output sink current: Ifg[mA]
6
Fig.10 FG output low voltage (Ta=25°C)
www.rohm.co
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
5/16
TSZ02201-0H1H0B100300-1-2
31.JUL.2012 Rev.002
5 Page 
BH67172NUX
Datasheet
●Thermal derating curve
Permissible dissipation (total loss) indicates the power that can be consumed by IC at Ta = 25ºC (normal temperature).
IC is heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The
temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, etc, and
consumable power is limited. Permissible dissipation is determined by the temperature allowed in IC chip (maximum
junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction
temperature is in general equal to the maximum value in the storage temperature range.
Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which
indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol
θja [C/W]. The temperature of IC inside the package can be estimated by this heat resistance. Below Figure shows the
model of heat resistance of the package.
Heat resistance θja, ambient temperature Ta, junction temperature Tj, and power consumption P can be calculated by the
equation below:
θja = (Tj－Ta) / P [℃/W]
Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal
resistance θja.
Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition,
wind velocity, etc even when the same package is used. Thermal derating curve indicates a reference value measured at
a specified condition. Below Figure shows a thermal derating curve. (Value when mounting FR4 glass epoxy board 74.2
[mm] x 74.2 [mm] x 1.6 [mm] (copper foil area below 3 [%]))
θja = (Tj-Ta) / P [℃/W]
Ambient temperature Ta [ºC]
Chip surface temperature Tj [ºC]]
Power consumption P[W]
Fig.18 Thermal resistance
1400
1200
1000
＊１
800
600
464
400
200
0
0
25
50
75 95 100
125
Ta(℃)
＊
＊１
Above Ta = 25ºC, derating by 4.64 mW/ºC
(When glass epoxy board (single layer) of 74.2 mm x 74.2 mm x 1.6 mm is mounted)
Above Ta=25℃, derating by 12 mW/℃
(When glass epoxy board (double layer) of 20.0mmx20.0mmX1.2mm is mounted.Top layer area
65mm2 ,Bottom area 8mm2 )
Fig.19 Thermal derating curve
www.rohm.co
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
11/16
TSZ02201-0H1H0B100300-1-2
31.JUL.2012 Rev.002
11 Page | ||
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| PDF Descargar | [ Datasheet BH67172NUX.PDF ] | |
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