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PDF NCS37010 Data sheet ( Hoja de datos )
| Número de pieza | NCS37010 | |
| Descripción | Self Test With Lockout Ground Fault Circuit Interrupter | |
| Fabricantes | ON Semiconductor | |
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NCS37010
Self Test With Lockout
Ground Fault Circuit
Interrupter (GFCI)
The NCS37010 is a fully UL943 compliant signal processor for
GFCI applications with self test and lockout. The device integrates a
flexible power supply (including both shunt and LDO regulators),
differential fault, and grounded−neutral detection circuits. Proprietary
impedance measurement and signal processing techniques are used to
minimize the number of external components and improve
performance. The device also includes a specialized DSP controller
that offers best in class immunity to nuisance loads without the need
for external analog filters. At power up the NCS37010 performs a self
test at 60ms and removes the lockout if the test passes. This self test
consists of a differential, ground−neutral and solenoid test.
Features
• 6.0 − 12 V Operation (120 − 480 V AC Mains with the Appropriate
Series Impedance)
• −40 to 85°C
• Very low power consumption: < 15 mW @ 6 V
• 16 Pin QFN or 20 Pin TSSOP Package
• Single Current Transformer (CT) Detection of Both Differential and
Grounded−Neutral Faults
• Full Self Test and Trip Indicator Monitoring.
• Self Test on Power Up Enables Lockout Functionality
• Self Syncing Internal Oscillator Adjusts to AC Mains Frequency to
Guarantee Full Resolution on 50 and 60 Hz Distribution Systems
• Optimized Solenoid Deployment (Coil is Not Energized Near the AC
Mains Zero Crossings)
• Randomized Testing Sequence to Minimize Noise and Potential
Interactions on the AC Mains
• >5 mA SCR Driver for Use with High Igt SCR’s for Improved Noise
Immunity
• Superior Immunity to Nuisance Loads/Noise (up to 10 A) Without
Loss of Detection Capability or CT Saturation
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
• Load Panel GFCI Breakers
• GFCI Receptacles
• In−line GFCI Circuits (Power Cords)
www.onsemi.com
MARKING
DIAGRAMS
1
QFN16
CASE 485G
NCS
37010
ALYWG
20
1
TSSOP−20
DB SUFFIX
CASE 948E
3701
0DBG
ALYWG
G
XXXXX = Specific Device Code
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
MLD
CTresGN
CTbias
CTstim
1
GND
LObar
PTT
TE
SCRtstEN
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information on page 10 of
this data sheet.
© Semiconductor Components Industries, LLC, 2014
October, 2014 − Rev. 1
1
Publication Order Number:
NCP37010/D
1 page  
NCS37010
APPLICATIONS INFORMATION
LOAD
FUSE
S3
BI−METAL
DB
ResMAIN
CapSup
S2 S1
ResPTT
CapSCR
LED
ResLED
ResMLD
MLD
ResGFTST
CTresGN
CapBias
CT
CapGN
ResGN
CTbias
CapCT
ResCT
CTstim
LObar
PTT
TE
SCRtstEN
TVS
LINE
ResD
CapIDF
Figure 2. Self Test GFCI Breaker with Lockout
www.onsemi.com
5
ResLOB
TEST
5 Page 
NCS37010
PACKAGE DIMENSIONS
0.15 (0.006) T U S
2X L/2 20
L
PIN 1
IDENT
1
0.15 (0.006) T U S
C
D
0.100 (0.004)
−T− SEATING
PLANE
TSSOP−20
CASE 948E−02
ISSUE C
20X K REF
0.10 (0.004) M T U S V S
11
B
−U−
10
A
−V−
GH
K
K1
ÍÍÍÍJ J1
ÍÍÍÍÍÍÍÍSECTION N−N
N 0.25 (0.010)
M
N
F
DETAIL E
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
−W−
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 6.40 6.60 0.252 0.260
B 4.30 4.50 0.169 0.177
C --- 1.20 --- 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC
0.026 BSC
H 0.27 0.37 0.011 0.015
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC
0.252 BSC
M 0_ 8_ 0_ 8_
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet NCS37010.PDF ] | |
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