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BCM400P500T1K8A31 fiches techniques PDF

Vicor - Fixed Ratio DC-DC Converter

Numéro de référence BCM400P500T1K8A31
Description Fixed Ratio DC-DC Converter
Fabricant Vicor 
Logo Vicor 





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BCM400P500T1K8A31 fiche technique
Features
Up to 1750 W continuous output power
2735 W/in3 power density
98.0% peak efficiency
4242 Vdc isolation
Parallel operation for multi-kW arrays
OV, OC, UV, short circuit and thermal protection
6123 through-hole ChiP package
n 2.494” x 0.898” x 0.286”
(63.34 mm x 22.80 mm x 7.26 mm)
PMBusTM management interface*
Typical Applications
380 DC Power Distribution
High End Computing Systems
Automated Test Equipment
Industrial Systems
High Density Power Supplies
Communications Systems
Transportation
BCM® Bus Converter
BCM400y500x1K8A31
®S
C US C NRTL US
Fixed Ratio DC-DC Converter
Product Ratings
VIN = 400 V (260 – 410 V)
VOUT = 50 V (32.5 – 51.3 V)
(NO LOAD)
POUT = up to 1750 W
K = 1/8
Product Description
The VI Chip® Bus Converter (BCM) is a high efficiency Sine
Amplitude Converter (SAC), operating from a 260 to 410 VDC
primary bus to deliver an isolated ratiometric output from
32.5 to 51.3 VDC.
The BCM400y500x1K8A31 offers low noise, fast transient
response, and industry leading efficiency and power density. In
addition, it provides an AC impedance beyond the bandwidth
of most downstream regulators, allowing input capacitance
normally located at the input of a POL regulator to be located at
the input of the BCM module. With a K factor of 1/8, that
capacitance value can be reduced by a factor of 64x, resulting
in savings of board area, material and total system cost.
The BCM400y500x1K8A31, combined with the D44TL1A0
Digital Supervisor and I13TL1A0 Digital Isolator, provide a
secondary referenced PMBus™ compatible telemetry and
control interface. This interface provides access to the BCM’s
internal controller configuration, fault monitoring, and other
telemetry functions.
Leveraging the thermal and density benefits of Vicor’s ChiP
packaging technology, the BCM module offers flexible thermal
management options with very low top and bottom side
thermal impedances. Thermally-adept ChiP-based power
components, enable customers to achieve low cost power
system solutions with previously unattainable system size,
weight and efficiency attributes, quickly and predictably.
*When used with D44TL1A0 and I13TL1A0 chipset
BCM® Bus Converter
Page 1 of 23
Rev 1.3
05/2015
vicorpower.com
800 927.9474

PagesPages 23
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