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PDF BM2LB150FJ-C Data sheet ( Hoja de datos )
| Número de pieza | BM2LB150FJ-C | |
| Descripción | 2ch Low Side Switch IC | |
| Fabricantes | ROHM Semiconductor | |
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Datasheet
Automotive IPD Series
2ch Low Side Switch IC
BM2LB150FJ-C
Features
■ Built-in overcurrent limiting circuit(OCP)
■ Built-in thermal shutdown circuit (TSD)
■ Direct control enabled from CMOS logic IC, etc.
■ Low On resistance RDS(ON) up to 150 m
(when VIN=5V, ID=0.5A, Tj=25°C)
■ Monolithic power management IC with the control
block (CMOS) and power MOS FET mounted on a
single chip
■ Surface mount package SOP-J8
■ AEC-Q100 Qualified (Note 1)
(Note 1) Grade1
General Description
The BM2LB150FJ-C is an automotive 2ch low side
switch IC, which has built-in overcurrent limiting circuit,
thermal shutdown circuit, and overvoltage (active clamp)
protection circuit.
Applications
2ch low side switch for driving resistive, inductive load,
Capacitive load
Product Summary
On-state resistance (Tj =25°C, Typ)
Overcurrent limit (Tj =25°C, Typ)
Output clamp voltage (Min)
Active clamp energy (Tj =25°C)
150mΩ
10A
42V
165mJ
Package
SOP-J8
W(Typ) x D(Typ) x H(Max)
4.90mm x 6.00mm x 1.65mm
Block Diagram
Active Clamp
Circuit
Thermal
Shutdown
Circuit
Overcurrent
Limiting
Circuit
Active Clamp
Circuit
Thermal
Shutdown
Circuit
Overcurrent
Limiting
Circuit
Product structure: Silicon monolithic integrated circuit
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
This product is not designed to protect it from radiation
1/13
TSZ02201-0G2G0BD00150-1-2
01.Aug.2016 Rev.003
1 page  
BM2LB150FJ-C
Measuring circuit
Datasheet
ID=1.0mA
ID =0.5 A
OUT
IN
GND
VCL
V
OUT
IN
VIN GND
RON = VDS / ID
V
Figure 2. Output clamp voltage measuring circuit
Figure 3. On-state resistance measuring circuit
VIN =0V/ 5V
VB=12V
RL = 15Ω
OUT
IN
GND
V
Figure 4. tON・tOFF measuring circuit
I/O Pin Truth Table
Operating Status
Normal
Overcurrent
Overheat
Input Signal
H
L
H
L
H
L
Output Level
L
H
Clamp
H
H
H
Output Status
ON
OFF
Current Limiting
OFF
OFF
OFF
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
5/13
TSZ02201-0G2G0BD00150-1-2
01.Aug.2016 Rev.003
5 Page 
BM2LB150FJ-C
Datasheet
Operational Notes
1. Grounding Interconnection Pattern
When a small-signal ground and a high-current ground are used, it is recommended to isolate the high-current
grounding interconnection pattern and the small-signal grounding interconnection pattern and establish a single
ground at the reference point of a set so that voltage changes due to the resistance and high current of patterned
interconnects will not cause any changes in the small-signal ground voltage. Pay careful attention to prevent changes
in the interconnection pattern of ground for external components.
The ground lines must be as short and thick as possible to reduce line impedance.
2. Thermal Design
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd)
in actual operating conditions.
3. Absolute Maximum Ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit
protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings.
4. Inspections on Set Board
If a capacitor is connected to a low-impedance pin in order to conduct inspections of the IC on a set board, stress may
apply to the IC. To avoid that, be sure to discharge the capacitor in each process. In addition, to connect or disconnect
the IC to or from a jig in the testing process, be sure to turn OFF the power supply prior to connecting the IC, and
disconnect it from the jig only after turning OFF the power supply. Furthermore, in order to protect the IC from static
electricity, establish a ground for the IC assembly process and pay utmost attention to transport and store the IC.
5. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
6. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
7. Thermal Shutdown Circuit
This IC has a built-in thermal shutdown circuit as an overheat-protection measure. The circuit is designed to turn
OFF output when the temperature of the IC chip exceeds 175C (Typ) and return the IC to the normal operation
when the temperature falls below 150C (Typ).
The thermal shutdown circuit is a circuit absolutely intended to protect the IC from thermal runaway, not intended
to protect or guarantee the IC. Consequently, do not operate the IC based on the subsequent continuous use or
operation of the circuit.
8. Overcurrent Limiting Circuit
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
9. Overvoltage (Active Clamp) Protection Function
This IC has a built-in overvoltage protection function in order for the IC to absorb counter-electromotive
force energy generated when inductive load is turned OFF. Since the input voltage is clamped at 0V
when the active clamp circuit is activated, the thermal shutdown circuit is disabled. Design a thermal
solution so that the chip temperature will definitely come to less than 150C.
10. Counter-electromotive Force
Fully ensure that the counter-electromotive force presents no problems
in the operation or the IC.
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
11/13
TSZ02201-0G2G0BD00150-1-2
01.Aug.2016 Rev.003
11 Page | ||
| Páginas | Total 17 Páginas | |
| PDF Descargar | [ Datasheet BM2LB150FJ-C.PDF ] | |
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