PDF NCV70624 Data sheet ( Hoja de datos )

Número de pieza	NCV70624
Descripción	Micro-stepping Motor Driver
Fabricantes	ON Semiconductor
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No Preview Available ! AMIS-30624, NCV70624 I2C Micro-stepping Motor Driver INTRODUCTION The AMIS−30624/NCV70624 is a single−chip micro−stepping motor driver with a position controller and control/diagnostic interface. It is ready to build intelligent peripheral systems where up to 32 drivers can be connected to one I2C master. This significantly reduces system complexity. The chip receives positioning instructions through the bus and subsequently drives the stator coils so the two−phase stepper motor moves to the desired position. The on−chip position controller is configurable (OTP or RAM) for different motor types, positioning ranges and parameters for speed, acceleration and deceleration. Micro−stepping allows silent motor operation and increased positioning resolution. The advanced motion qualification mode enables verification of the complete mechanical system in function of the selected motion parameters. The AMIS−30624/NCV70624 can easily be connected to an I2C bus where the I2C master can fetch specific status information like actual position, error flags, etc. from each individual slave node. An integrated sensorless step−loss detection prevents the positioner from loosing steps and stops the motor when running into stall. This enables silent, yet accurate position calibrations during a referencing run and allows semi−closed loop operation when approaching the mechanical end−stops. The chip is implemented in I2T100 technology, enabling both high voltage analog circuitry and digital functionality on the same chip. The NCV70624 is fully compatible with the automotive voltage requirements. http://onsemi.com SOIC−20 4 or DW010 SUFFIX CASE 751AQ NQFP−32 5 SUFFIX CASE 560AA ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. PRODUCT FEATURES Motor Driver  Micro−Stepping Technology  Sensorless Step−Loss Detection  Peak Current Up to 800 mA  Fixed Frequency PWM Current−Control  Selectable PWM Frequency  Automatic Selection of Fast and Slow Decay Mode  No external Fly−back Diodes Required  14 V/24 V Compliant  Motion Qualification Mode (Note 1) Controller with RAM and OTP Memory  Position Controller  Configurable Speeds and Acceleration  Input to Connect Optional Motion Switch I2C Interface  Bi−Directional 2−Wire Bus for Inter IC Control  Field Programmable Node Addresses  Full Diagnostics and Status Information Protection  Overcurrent Protection  Undervoltage Management  Open−circuit Detection  High Temperature Warning and Management  Low Temperature Flag EMI Compatibility  High Voltage Outputs with Slope Control Patents  US 7,271,993  US 7,288,956  This is a Pb−Free Device  NCV Prefix for Automotive and Other Applications Requiring Site and Control Changes 1. Not applicable for “Product Versions NCV70624DW010G, NCV70624DW010R2G”  Semiconductor Components Industries, LLC, 2009 September, 2009 − Rev. 5 1 Publication Order Number: AMIS−30624/D 1 page AMIS−30624, NCV70624 PACKAGE THERMAL RESISTANCE The AMIS−30624/NCV70624 is available in SOIC−20 or optimized NQFP−32 packages. For cooling optimizations, the NQFP has an exposed thermal pad which has to be soldered to the PCB ground plane. The ground plane needs thermal vias to conduct the head to the bottom layer. Figures 3 and 4 give examples for good power distribution solutions. For precise thermal cooling calculations the major thermal resistances of the devices are given. The thermal media to which the power of the devices has to be given are:  Static environmental air (via the case)  PCB board copper area (via the device pins and exposed pad) The thermal resistances are presented in Table 5: DC Parameters. The major thermal resistances of the device are the Rth from the junction to the ambient (Rthja) and the overall Rth from the junction to the leads (Rthjp). The NQFP device is designed to provide superior thermal performance. Using an exposed die pad on the bottom surface of the package is mainly contributing to this performance. In order to take full advantage of the exposed pad, it is most important that the PCB has features to conduct heat away from the package. A thermal grounded pad with thermal vias can achieve this. In the table below, one can find the values for the Rthja and Rthjp, simulated according to the JESD−51 norm: Package SOIC−20 NQFP−32 Rth Junction−to−Leads and Exposed Pad − Rthjp 0,95 Rth Junction−to−Leads Rthjp 19 The Rthja for 2S2P is simulated conform to JESD−51 as follows:  A 4−layer printed circuit board with inner power planes and outer (top and bottom) signal layers is used  Board thickness is 1.46 mm (FR4 PCB material)  The 2 signal layers: 70 mm thick copper with an area of 5500 mm2 copper and 20% conductivity ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Figure 3. Example of SOIC−20 PCB Ground Plane Layout (preferred layout at top and bottom) Rth Junction−to−Ambient Rthja (1S0P) 62 60 Rth Junction−to−Ambient Rthja (2S2P) 39 30  The 2 power internal planes: 36 mm thick copper with an area of 5500 mm2 copper and 90% conductivity The Rthja for 1S0P is simulated conform to JESD−51 as follows:  A 1−layer printed circuit board with only 1 layer  Board thickness is 1.46 mm (FR4 PCB material)  The layer has a thickness of 70 mm copper with an area of 5500 mm2 copper and 20% conductivity ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎNQFÎÎÎÎÎÎÎP−3ÎÎÎÎÎÎÎÏÏÏ2 ÎÎÎÎÎÎÎÏÏÏÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Figure 4. Example of NQFP−32 PCB Ground Plane Layout (preferred layout at top and bottom) http://onsemi.com 5 5 Page AMIS−30624, NCV70624 POSITIONING PARAMETERS Stepping Modes One of four possible stepping modes can be programmed:  Half−stepping  1/4 micro−stepping  1/8 micro−stepping  1/16 micro−stepping Maximum Velocity For each stepping mode, the maximum velocity Vmax can be programmed to 16 possible values given in the table below. The accuracy of Vmax is derived from the internal oscillator. Under special circumstances it is possible to change the Vmax parameter while a motion is ongoing. All 16 entries for the Vmax parameter are divided into four groups. When changing Vmax during a motion the application must take care that the new Vmax parameter stays within the same group. Table 7. MAXIMUM VELOCITY SELECTION TABLE Vmax Index Vmax Hex Dec (full step/s) Group 00 99 A 11 136 22 167 33 44 197 213 B 55 228 66 243 77 273 88 303 99 A 10 334 364 C B 11 395 C 12 456 D 13 546 E 14 729 D F 15 973 Half−stepping (half−step/s) 197 273 334 395 425 456 486 546 607 668 729 790 912 1091 1457 1945 Stepping Mode 1/4th Micro−stepping (micro−step/s) 1/8th Micro−stepping (micro−step/s) 395 790 546 1091 668 1335 790 1579 851 1701 912 1823 973 1945 1091 2182 1213 2426 1335 2670 1457 2914 1579 3159 1823 3647 2182 4364 2914 5829 3891 7782 1/16th Micro−stepping (micro−step/s) 1579 2182 2670 3159 3403 3647 3891 4364 4852 5341 5829 6317 7294 8728 11658 15564 http://onsemi.com 11 11 Page

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