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MA-COM - GaAs Broadband High Power SP3T Switch

Numéro de référence MASW-009482
Description GaAs Broadband High Power SP3T Switch
Fabricant MA-COM 
Logo MA-COM 





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MASW-009482 fiche technique
MASW-009482
GaAs Broadband High Power SP3T Switch
DC - 4.0 GHz
Features
CDMA Handset Switching Applications
Balanced (symmetrical) RF Ports
Low Cross Modulation
Low Insertion Loss: 0.55 dB @ 1 GHz
High Isolation: 27 dB @ 1 GHz
High Power: P0.1dB = 36 dBm @ 1 GHz
0.5 micron GaAs pHEMT Process
Lead-Free 2 mm 12-Lead STQFN package with
0.5 mm lead pitch
Halogen-Free ―Green‖ Mold Compound
RoHS* Compliant and 260°C Reflow Compatible
Description
The MASW-009482 is an industry leading GaAs
pHEMT MMIC single pole three throw (SP3T) switch
in a lead-free 2 mm 12-lead STQFN package with
0.5 mm lead pitch. The MASW-009482 is uniquely
configured to enable switching from a common
antenna port to CDMA Cellular, PCS, or AWS ports.
It is also ideal for other applications where a com-
pact, high performance, symmetrical SP3T switch
is required.
The design is symmetric and has been fully
optimized for excellent cross modulation perform-
ance in all three paths while still maintaining excel-
lent insertion loss and isolation. The symmetrical
design allows the user to assign CDMA Cellular,
PCS and AWS to ports RF1, RF2 or RF3 as
required to optimize the layout.
The MASW-009482 is fabricated using a 0.5 micron
gate length GaAs pHEMT process. The process
features full passivation for performance and
reliability.
Ordering Information1,2
Part Number
Package
MASW-009482-TR3000
3000 piece reel
MASW-009482-001SMB
Sample Board
0.05 - 4.0 GHz Tuning
1. Reference Application Note M513 for reel size information.
2. All sample boards include 5 loose parts.
Functional Schematic
GND RFC GND
12
V3 1
Rev. V1
V1
RF3 RF1
GND
GND
GND RF2
V2
Pin Configuration 3
Pin No.
Function
Description
1 V3
Control 3
2 RF3
RF Port 3
3 GND
Ground
4 GND
Ground
5 RF2
RF Port 2
6 V2
Control 2
7 GND
Ground
8 RF1
RF Port 1
9 V1
Control 1
10 GND
Ground
11 RFC
RF Common
12 GND
Ground
13 GND (paddle)
Ground
3. All package ground pins (P3,4,7,10, 12) and paddle ground
are no connection (N/C) electrically to the internal die.
M/A-COM Technology recommends connecting all ground
connections to PCB ground to ensure a good thermal path.
* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support

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