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PDF HV7022 Data sheet ( Hoja de datos )
| Número de pieza | HV7022 | |
| Descripción | 34-Channel Symmetric Row Driver | |
| Fabricantes | Microchip | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de HV7022 (archivo pdf) en la parte inferior de esta página. Total 15 Páginas | ||
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HV7022
34-Channel Symmetric Row Driver
Features
• High-Voltage CMOS technology
• Symmetric row drive (reduces latent imaging in
ACTFEL displays)
• Output voltage up to +230V
• Low power level shifting
• Source/sink current minimum 70 mA
• Shift register speed 4.0 MHz
• Pin-programmable shift direction
Package Type
6
Description
HV7022 is a low-voltage serial to high-voltage parallel
converter with push-pull outputs. It is especially suited
for use as a symmetric row driver in AC thin-film elec-
troluminescent (ACTFEL) displays. HV7022 offers 34
output lines, a direction (DIR) pin to give CW or CCW
shift register loading, output enable (OE), and polarity
(POL) control. After data is entered on the falling edge
of CLK, a logic high will cause the output to swing to
VPP if POL is high, or to GND if POL is low.
1 44
40
See Table 2-1 for pin information
44-Lead PLCC
2016 Microchip Technology Inc.
DS20005428A-page 1
1 page  
1.1 Power up and Recommended
Operating Conditions
To power-up HV7022, perform the following power-up
sequence:
1. Connect ground
2. Apply VDD
3. Set all inputs (Data, CLK, Enable, etc) to a
known state.
4. Apply VPP (VPP should not drop below VDD or
float during operation).
To power-down the device, reverse the steps above.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter
VDD Logic supply voltage
VPP High voltage supply
VIH High-level input voltage
VDD = 10.8
VDD = 13.2
VIL Low-level input voltage
VDD = 10.8
VDD = 13.2
fCLK Clock frequency
TA Operating free-air temperature
IOD Allowable pulsed current through output diode.
HV7022
Min Max Units
10.8 13.2
V
– 230 V
8.1 –
9.9 –
V
-
-
2.7
3.3
V
- 4.0 MHz
-40 +85 °C
–
±300
mA
2016 Microchip Technology Inc.
DS20005428A-page 5
5 Page 
HV7022
44-Lead PLCC Package Outline (PJ)
.653x.653in body, .180in height (max), .050in pitch
.048/.042 x 45O
6
D
D1
1 44
40
.056/.042 x 45O
.150 MAX
.075 MAX
Note 1
(Index Area)
E1 E
.020max
(3 Places)
Note 2
Top View
Vertical Side View
A
A2
A1
e
Horizontal Side View
View B
Base .020 MIN
Plane
Seating
Plane
b1
b
View B
R
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
Notes:
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a printed indicator.
2. $FWXDOVKDSHRIWKLVIHDWXUHPD\YDU\
Symbol
A A1 A2 b
Dimension
(inches)
MIN
NOM
MAX
.165
.172
.180
.090
.105
.120
.062
-
.083
.013
-
.021
JEDEC Registration MS-018, Variation AC, Issue A, June, 1993.
† This dimension differs from the JEDEC drawing.
Drawings not to scale.
b1
.026
-
.036†
D
.685
.690
.695
D1
.650
.653
.656
E
.685
.690
.695
E1
.650
.653
.656
e
.050
BSC
R
.025
.035
.045
2016 Microchip Technology Inc.
DS20005428A-page 11
11 Page | ||
| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet HV7022.PDF ] | |
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