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PDF MPX2200A Data sheet ( Hoja de datos )

Número de pieza MPX2200A
Descripción On-Chip Temperature Compensated & Calibrated Pressure Sensors
Fabricantes Motorola Semiconductors 
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No Preview Available ! MPX2200A Hoja de datos, Descripción, Manual

MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MPX2200/D
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The MPX2200 and MPX2201 series device is a silicon piezoresistive pressure sensor
providing a highly accurate and linear voltage output — directly proportional to the
applied pressure. The sensor is a single monolithic silicon diaphragm with the strain
gauge and a thin–film resistor network integrated on–chip. The chip is laser trimmed for
precise span and offset calibration and temperature compensation. They are designed
for use in applications such as pump/motor controllers, robotics, level indicators, medical
diagnostics, pressure switching, barometers, altimeters, etc.
Features
Temperature Compensated Over 0°C to + 85°C
Patented Silicon Shear Stress Strain Gauge
• ± 0.25% Linearity (MPX2200D)
Easy to Use Chip Carrier Package
Available in Absolute, Differential and Gauge Configurations
Application Examples
Pump/Motor Controllers
Robotics
Level Indicators
Medical Diagnostics
Pressure Switching
Barometers
Altimeters
Figure 1 illustrates a block diagram of the internal circuitry on the stand–alone
pressure sensor chip.
VS
3
X–ducer
SENSING
ELEMENT
THIN FILM
TEMPERATURE
COMPENSATION
AND
CALIBRATION
CIRCUITRY
2
Vout+
4 Vout–
1
GND
Figure 1. Temperature Compensated Pressure Sensor Schematic
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X–ducer is directly proportional to the differential
pressure applied.
The absolute sensor has a built–in reference vacuum. The output voltage will decrease
as vacuum, relative to ambient, is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor increases with increasing
pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly,
output voltage increases as increasing vacuum is applied to the vacuum (P2) side
relative to the pressure (P1) side.
Preferred devices are Motorola recommended choices for future use and best overall value.
Senseon and X–ducer are trademarks of Motorola, Inc.
REV 7
© MMotootroolrao, lIanc.S1e9n97sor Device Data
MMSPPEXXR22I22E00S01
Motorola Preferred Device
0 to 200 kPa (0 to 29 psi)
40 mV FULL SCALE SPAN
(TYPICAL)
BASIC CHIP
CARRIER ELEMENT
CASE 344–15, STYLE 1
DIFFERENTIAL
PORT OPTION
CASE 344C–01, STYLE 1
NOTE: Pin 1 is the notched pin.
PIN NUMBER
1 Gnd 3 VS
2 +Vout 4 –Vout
1

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MPX2200A pdf
PACKAGE DIMENSIONS
MPX2200 MPX2201 SERIES
C
POSITIVE
R PRESSURE (P1)
M
B –A–
PIN 1
1234
N
L
–T–
SEATING
PLANE
J POSITIVE
PRESSURE
F
(P1) D 4 PL
G
0.136 (0.005) M T A M
CASE 344–15
ISSUE W
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION –A– IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
INCHES
DIM MIN MAX
A 0.595 0.630
B 0.514 0.534
C 0.200 0.220
D 0.016 0.020
F 0.048 0.064
G 0.100 BSC
J 0.014 0.016
L 0.695 0.725
M 30_ NOM
N 0.475 0.495
R 0.430 0.450
MILLIMETERS
MIN MAX
15.11 16.00
13.06 13.56
5.08 5.59
0.41 0.51
1.22 1.63
2.54 BSC
0.36 0.40
17.65 18.42
30_ NOM
12.07 12.57
10.92 11.43
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. – OUTPUT
PORT #2
VACUUM
PRESSURE
(P2)
–B– V
C
N
R
SEATING
PLANE
–T–
POSITIVE
PRESSURE
(P1)
PIN 1
A
12 34
K
S
JG
F
D 4 PL
0.13 (0.005) M T B M
CASE 344A–01
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
A 0.690 0.720
B 0.245 0.255
C 0.780 0.820
D 0.016 0.020
F 0.048 0.064
G 0.100 BSC
J 0.014 0.016
K 0.345 0.375
N 0.300 0.310
R 0.178 0.186
S 0.220 0.240
V 0.182 0.194
MILLIMETERS
MIN MAX
17.53 18.28
6.22 6.48
19.81 20.82
0.41 0.51
1.22 1.63
2.54 BSC
0.36 0.41
8.76 9.53
7.62 7.87
4.52 4.72
5.59 6.10
4.62 4.93
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. – OUTPUT
Motorola Sensor Device Data
5

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