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PDF CPC3909 Data sheet ( Hoja de datos )
| Número de pieza | CPC3909 | |
| Descripción | 400V N-Channel Depletion-Mode FET | |
| Fabricantes | IXYS | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de CPC3909 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
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INTEGRATED CIRCUITS DIVISION
PRELIMINARY
CPC3909
400V N-Channel
Depletion-Mode FET
Parameter
Drain-to-Source Voltage - V(BR)DSX
Max On-Resistance - RDS(on)
Max Power
SOT-89 Package
SOT-223 Package
Rating
400
6
1.1
2.5
Units
V
W
Features
• 400V Drain-to-Source Voltage
• Depletion Mode Device Offers Low RDS(on)
at Cold Temperatures
• Low On-Resistance: 4.5 (Typical) @ 25°C
• Low VGS(off) Voltage
• High Input Impedance
• Low Input and Output Leakage
• Small Package Size SOT-89 and SOT-223
• PC Card (PCMCIA) Compatible
• PCB Space and Cost Savings
Applications
• LED Drive Circuits
• Telecommunications
• Normally On Switches
• Ignition Modules
• Converters
• Security
• Power Supplies
• Regulators
Description
The CPC3909 is an N-channel, depletion mode Field
Effect Transistor (FET) that is available in an
SOT-223 package (CPC3909Z) and an SOT-89
package (CPC3909C). Both utilize IXYS Integrated
Circuits Division’s proprietary vertical DMOS process
that realizes world class, high voltage MOSFET
performance in an economical silicon gate process.
The vertical DMOS process yields a highly reliable
device, particularly for use in difficult application
environments such as telecommunications, security,
and power supplies.
CPC3909Z and the CPC3909C have a typical
on-resistance of 4.5 and a drain-to-source voltage
of 400V. As with all MOS devices, the FET structure
prevents thermal runaway and thermally induced
secondary breakdown.
Ordering Information
Part Number
CPC3909CTR
CPC3909ZTR
Description
SOT-89: Tape and Reel (1000/Reel)
SOT-223: Tape and Reel (1000/Reel)
Circuit Symbol
G
D
S
Package Pinout:
D
4
123
GDS
Pin Number
1
2
3
4
Name
GATE
DRAIN
SOURCE
DRAIN
DS-CPC3909-R00D
PRELIMINARY
1
1 page  
INTEGRATED CIRCUITS DIVISION
Manufacturing Information
Moisture Sensitivity
PRELIMINARY
CPC3909
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
CPC3909C / CPC3909Z
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
CPC3909C / CPC3909Z
Maximum Temperature x Time
260ºC for 30 seconds
Maximum Reflow Cycles
3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or
Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be
used.
R00D
PRELIMINARY
5
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet CPC3909.PDF ] | |
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