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PDF CHM1290 Data sheet ( Hoja de datos )

Número de pieza CHM1290
Descripción 20-30GHz SUB-HARMONICALLY PUMPED MIXER
Fabricantes United Monolithic Semiconductors 
Logotipo United Monolithic Semiconductors Logotipo



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No Preview Available ! CHM1290 Hoja de datos, Descripción, Manual

CHM1290
20-30GHz SUB-HARMONICALLY PUMPED MIXER
GaAs Monolithic Microwave IC
Description
The CHM1290 is a MFC which integrates a self
biased LO buffer amplifier and a sub-
harmonically diodes mixer for 2LO suppression
It is usable both for up-conversion and down-
conversion. It is designed for a wide range of
applications,
typically
commercial
communication systems for broadband local
access (LMDS). The backside of the chip is both
RF and DC grounds. This helps simplify the
assembly process.
The circuit is manufactured with a PM-HEMT
process, 0.25µm gate length, capacities over via
holes, via holes through the substrate, air
bridges and electron beam gate lithography.
It is available in chip form.
Main Features
Broadband performance : 20-30GHz
10dB conversion Loss
29dB 2LO to RF isolation
-4dBm LO input power
-3dBm input power 1 dB compression
Low DC power consumption, [email protected]
Chip size : 0.86 X 1.28 X 0.10 mm
Main Characteristics
Tamb. = 25°C
Parameter
Min Typ Max Unit
FRF RF frequency range
FLO LO frequency range
FIF IF frequency range
Lc Conversion Loss
20
10
DC
10
30 GHz
15 GHz
6 GHz
12 dB
ESD Protection : Electrostatic discharge sensitive device. Observe handling precautions !
Ref. : DSCHM12902045 - 14-Feb.-02
1/6 Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

1 page




CHM1290 pdf
20-30GHz SHP Mixer
Chip Assembly and Mechanical Data
CHM1290
Vd Voltage
RF
Input/Output bonding wires as
short as possible
10nF
120pF
IF
Input/Output DC coupled to
diodes
LO
Input/Output bonding wires as
short as possible
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended
Bonding pad positions
810 +/- 35
35
1280 +/- 35
860
760
260
140
35
( Chip thickness : 100µm. All dimensions are in micrometers )
Ref. : DSCHM12902045 - 14-Feb.-02
5/6 Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

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