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PDF MBNP01Q40Q8 Data sheet ( Hoja de datos )
| Número de pieza | MBNP01Q40Q8 | |
| Descripción | Complex Transistors | |
| Fabricantes | CYStech Electronics | |
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CYStech Electronics Corp.
Complex Transistors
MBNP01Q40Q8
Spec. No. : C068Q8
Issued Date : 2016.05.27
Revised Date : 2016.05.30
Page No. : 1/11
Features
• Two PNP and two NMOS chips are assembled in a standard SOP-8 package
• Mounting area could be greatly reduced.
• Pb-free lead plating and halogen-free package
Equivalent Circuit
MBNP01Q40Q8
Outline
SOP-8
G：Gate S：Source D：Drain
B : Base C : Collector E : Emitter
Ordering Information
Device
MBNP01Q40Q8-0-T3-G
Package
Shipping
SOP-8
(Pb-free lead plating & halogen-free package)
2500 pcs / Tape & Reel
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T3 : 2500 pcs / tape & reel,13” reel
Product rank, zero for no rank products
Product name
MBNP01Q40Q8
CYStek Product Specification
1 page  
CYStech Electronics Corp.
Spec. No. : C068Q8
Issued Date : 2016.05.27
Revised Date : 2016.05.30
Page No. : 5/11
Typical Characteristics : NMOS
Typical Output Characteristics
2.0
1.6
10V, 9V, 8V,7V,6V,5V,4V,3.5V
1.2
Brekdown Voltage vs Ambient Temperature
1.4
1.2
1
0.8 VGS=3V
0.4
0.0
0
VGS=2.5V
5 10 15 20 25 30 35 40 45 50
VDS, Drain-Source Voltage(V)
0.8
0.6 ID=250μA,
VGS=0V
0.4
-75 -50 -25 0 25 50 75 100 125 150 175
Tj, Junction Temperature(°C)
Static Drain-Source On-State resistance vs Drain Current
10
Reverse Drain Current vs Source-Drain Voltage
1.2
VGS=4.5V
VGS=10V
1
Tj=25°C
0.8
0.6
Tj=150°C
0.4
1
0.01
0.1 1
ID, Drain Current(A)
10
Static Drain-Source On-State Resistance vs Gate-Source
Voltage
10
ID=100mA
8
0.2
0
0.2 0.4 0.6 0.8
IDR, Reverse Drain Current(A)
1
Drain-Source On-State Resistance vs Junction Tempearture
2.5
VGS=10V, ID=100mA
2
6 1.5
41
2
0
0 2 4 6 8 10
VGS, Gate-Source Voltage(V)
0.5
RDS(ON)@Tj=25°C : 4.2 Ω typ
0
-75 -50 -25 0 25 50 75 100 125 150 175
Tj, Junction Temperature(°C)
MBNP01Q40Q8
CYStek Product Specification
5 Page 
SOP-8 Dimension
Top View
A
CYStech Electronics Corp.
Right side View
G
Marking:
Spec. No. : C068Q8
Issued Date : 2016.05.27
Revised Date : 2016.05.30
Page No. : 11/11
B
D
Front View
Part A
F
I
CH
Device Name
J Date Code
EK
Part A L
M
N
O
MBNP01
Q40
8-Lead SOP-8 Plastic Package
CYStek Package Code: Q8
DIM
Inches
Min. Max.
A 0.1909 0.2007
B 0.1515 0.1555
C 0.2283 0.2441
D 0.0480 0.0519
E 0.0145 0.0185
F 0.1472 0.1527
G 0.0570 0.0649
H 0.1889 0.2007
Millimeters
Min. Max.
4.85 5.10
3.85 3.95
5.80 6.20
1.22 1.32
0.37 0.47
3.74 3.88
1.45 1.65
4.80 5.10
DIM
Inches
Min. Max.
I 0.0019 0.0078
J 0.0118 0.0275
K 0.0074 0.0098
L 0.0145 0.0204
M 0.0118 0.0197
N 0.0031 0.0051
O 0.0000 0.0059
*: Typical
Millimeters
Min. Max.
0.05 0.20
0.30 0.70
0.19 0.25
0.37 0.52
0.30 0.50
0.08 0.13
0.00 0.15
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MBNP01Q40Q8
CYStek Product Specification
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet MBNP01Q40Q8.PDF ] | |
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