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PDF EClamp2454P Data sheet ( Hoja de datos )
| Número de pieza | EClamp2454P | |
| Descripción | ESD/EMI Protection | |
| Fabricantes | Semtech | |
| Logotipo |  |
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PROTECTION PRODUCTS - EMIClampTM
Description
The EClampTM2454P is a (L-C) low pass filter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solid-
state silicon-avalanche technology for superior clamp-
ing performance and DC electrical characteristics.
They have been optimized for protection of color
LCD and camera lines in cellular phones and other
portable electronics.
The device consists of four identical circuits comprised
of TVS diodes for ESD protection, and a 5-pole induc-
tor - capacitor network for EMI/RFI filtering. A typical
inductor value of 28nH and a capacitor value of 12pF
are used to achieve 40dB minimum attenuation at
800MHz. The TVS diodes provide effective suppression
of ESD voltages in excess of ±15kV (air discharge) and
±8kV (contact discharge) per IEC 61000-4-2, level 4.
The EClamp2454P is in a 8-pin, RoHS/WEEE compliant,
SLP2116P8 package. It measures 2.1 x 1.6 x 0.58mm.
The leads are spaced at a pitch of 0.5mm and are
finished with lead-free NiPd. The small package makes it
ideal for use in portable electronics such as cell phones,
digital still cameras, and PDAs.
Features
EClamp2454P
ESD/EMI Protection
for Color LCD Interfaces
PRELIMINARY
Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
Filter performance: 40dB minimum attenuation at
800MHz to 2.7GHz
TVS working voltage: 5V
Inductor: 28nH (Typical)
Capacitors: 12pF (Typical at VR = 2.5V)
Protection and filtering for four lines
Solid-state technology
Mechanical Characteristics
SLP2116P8 8-pin package
RoHS/WEEE Compliant
Nominal Dimensions: 2.1 x 1.6 x 0.58 mm
Lead Pitch: 0.5mm
Lead finish: NiPd
Marking: Marking Code
Packaging: Tape and Reel per EIA 481
Applications
Color LCD Protection
Cell Phone CCD Camera Lines
Clamshell Cell Phones
Circuit Diagram (Each Line)
Package Configuration
L1 L2
IN
C1 C2
C3
OUT
GND
2.10
12
1.60
0.50 BSC
0.58
Device Schematic (4X)
Revision 03/29/2006
8 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1 www.semtech.com
1 page  
EClamp2454P
PROTECTION PRODUCTS
Applications Information
Figure 3 shows the recommended device layout. The
ground pad vias have a diameter of 0.008 inches (0.20
mm) while the two external vias have a diameter of
0.010 inches (0.250mm). The internal vias are spaced
approximately evenly from the center of the pad. The
designer may choose to use more vias with a smaller
diameter (such as 0.005 inches or 0.125mm) since
changing the diameter of the via will result in little
change in inductance (i.e. the log function in Equation 2
in highly insensitive to parameter d) . Figure 4 shows a
typical insertion loss (S21) plot for the device using
Semtech’s filter evaluation board with 50 Ohm traces
and the recommended via configuration.
Figure 3 - Recommended Layout Using Ground Vias
PRELIMINARY
Figure 4 - Filter Characteristics Using Recommended
Layout with Internal Vias
CH1 S21 LOG 6 dB / REF 0 dB
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB
-54 dB
1
MHz
START. 030 MHz
10
MHz
1: -5.3134 dB
156 MHz
2: -41.559 dB
800 MHz
1
3: -41.327 dB
1.8 GHz
4: -40.105 dB
2.7 GHz
4
23
100
MHz
13
GHz GHz
STOP 3000.000000 MHz
2006 Semtech Corp.
5
www.semtech.com
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet EClamp2454P.PDF ] | |
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