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Semtech - ESD/EMI Protection

Numéro de référence EClamp2386P
Description ESD/EMI Protection
Fabricant Semtech 
Logo Semtech 





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EClamp2386P fiche technique
PROTECTION PRODUCTS - EMIClampTM
Description
The EClampTM2386P is a low pass filter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solid-
state silicon-avalanche technology for superior clamp-
ing performance and DC electrical characteristics.
They have been optimized for protection of color
LCD panels in cellular phones and other portable
electronics.
The device consists of six identical circuits comprised
of TVS diodes for ESD protection, and a resistor -
capacitor network for EMI/RFI filtering. A series
resistor value of 200and a capacitance value of 12pF
are used to achieve 30dB minimum attenuation from
800MHz to 2.7GHz. The TVS diodes provide effective
suppression of ESD voltages in excess of ±15kV (air
discharge) and ±8kV (contact discharge) per IEC 61000-
4-2, level 4.
The EClamp2386P is in a 12-pin, RoHS/WEEE compli-
ant, SLP3016P12 package. It measures 3.0 x 1.6 x
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPd. The small pack-
age makes it ideal for use in portable electronics such
as cell phones, digital still cameras, and PDAs.
Features
EClamp2386P
ESD/EMI Protection
for Color LCD Interfaces
PRELIMINARY
‹ Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
‹ ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
‹ Filter performance: 30dB minimum attenuation
800MHz to 2.7GHz
‹ TVS working voltage: 5V
‹ Resistor: 200Ω +/− 15%
‹ Total Capacitance: 12pF (VR = 2.5V)
‹ Protection and filtering for six lines
‹ Solid-state technology
Mechanical Characteristics
‹ SLP3016P12 12-pin package
‹ RoHS/WEEE Compliant
‹ Nominal Dimensions: 3.0 x 1.6 x 0.58 mm
‹ Lead Pitch: 0.5mm
‹ Lead finish: NiPd
‹ Marking: Marking Code
‹ Packaging: Tape and Reel per EIA 481
Applications
‹ Color LCD Protection
‹ Cell Phone CCD Camera Lines
‹ Clamshell Cell Phones
Circuit Diagram (Each Line)
Package Configuration
200
IN
OUT
12pF 12pF
GND
3.00
12
1.60
0.50 BSC
0.58
Device Schematic (6X)
Revision 1/25/2006
12 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1 www.semtech.com

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