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Numéro de référence | EClamp2376P | ||
Description | ESD/EMI Protection | ||
Fabricant | Semtech | ||
Logo | |||
1 Page
PROTECTION PRODUCTS - EMIClampTM
Description
The EClampTM2376P is a low pass filter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solid-
state silicon-avalanche technology for superior clamp-
ing performance and DC electrical characteristics.
They have been optimized for protection of color
LCD panels in cellular phones and other portable
electronics.
The device consists of six identical circuits comprised
of TVS diodes for ESD protection, and a resistor -
capacitor network for EMI/RFI filtering. A series
resistor value of 100Ω and a capacitance value of
10pF are used to achieve 30dB minimum attenuation
from 1.8GHz to 2.5GHz. The TVS diodes provide
effective suppression of ESD voltages in excess of
±15kV (air discharge) and ±8kV (contact discharge) per
IEC 61000-4-2, level 4.
The EClamp2376P is in a 12-pin, RoHS compliant,
SLP3016P12 package. It measures 3.0 x 1.6 x
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPd. The small pack-
age makes it ideal for use in portable electronics such
as cell phones, digital still cameras, and PDAs.
Features
EClamp2376P
ESD/EMI Protection
for Color LCD Interfaces
PRELIMINARY
Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
Filter performance: 30dB minimum attenuation
1.8GHz to 2.5GHz
TVS working voltage: 5V
Resistor: 100Ω +/− 15%
Typical Capacitance: 20pF (VR = 0V)
Protection and filtering for six lines
Solid-state technology
Mechanical Characteristics
SLP3016P12 12-pin package
RoHS/WEEE Compliant
Nominal Dimensions: 3.0 x 1.6 x 0.58 mm
Lead Pitch: 0.5mm
Lead finish: NiPd
Marking : Marking Code
Packaging : Tape and Reel per EIA 481
Applications
Color LCD Protection
Cell Phone CCD Camera Lines
Clamshell Cell Phones
Circuit Diagram (Each Line)
Package Configuration
100 Ω
IN
OUT
10pF 10pF
3.00
12
1.60
0.50 BSC
GND
0.58
Device Schematic (6X)
Revision 12/6/2005
12 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1 www.semtech.com
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Pages | Pages 8 | ||
Télécharger | [ EClamp2376P ] |
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